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Authored books
| 1. | D.W. McCall, G.M. Amdahl, D.D.L. Chung, B.K. Gilbert, H. Hilibrand, D.C. Hofer, J.C.Logue,
C.A. Neugebauer, R.F.W. Pease, P. Penfield Jr., R.L. Schwoebel and B.H. Whalen,
Materials for High Density Electronic Packaging and Interconnection, Report of the
Committee on Materials for High Density Electronic Packaging, National Materials Advisory
Board, Commission on Engineering and Technical Systems, National Research Council, Report
#NMAB-449, National Academy Press, Washington, D.C., 1990. |
| 2. | D.D.L. Chung, P.W. DeHaven, H. Arnold and D. Ghosh, X-Ray Diffraction at Elevated Temperatures,
VCH Publishers, 1993. |
| 3. | D.D.L. Chung, Carbon Fiber Composites, Butterworth-Heinemann, 1994. |
| 4. | D.D.L. Chung, Composite Materials for Electronic Functions, Materials Science Foundations,
Vol. 12, Trans Tech Publications, Switzerland, 2000. |
| 5. | D.D.L. Chung, Applied Materials Science, CRC Press, 2001. |
| 6. | D.D.L. Chung, Composite Materials: Functional Materials for Modern Technologies,
Engineering Materials and Processes Book Series, Brian Derby, Series Editor, Springer, 2003. |
| 7. | D.D.L. Chung, Multifunctional Cement-Based Materials, Civil and Environmental Engineering
Book Series, Mike Meyer, Series Editor, Marcel Dekker, 2003. |
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